Nā pōmaikaʻi o ka phenolic foam insulation board

1. Nā hemahema o ka polyurethane: maʻalahi e puhi i ke ahi, maʻalahi e hana i ke kinoea ʻawaʻawa a hoʻoweliweli i ke olakino kanaka;
2. Nā hemahema o ka polystyrene: maʻalahi e puhi i ke ahi, emi ma hope o ka hoʻohana lōʻihi ʻana, a maikaʻi ʻole ka hana insulation thermal;
3. Nā hemahema o ka hulu hipa pōhaku a me ka hulu hipa aniani: hoʻopilikia ia i ke kaiapuni, hoʻohua i ka bacteria, he kiʻekiʻe ka wai absorption, maikaʻi ʻole ka hopena insulation thermal, ikaika maikaʻi ʻole a me ke ola lawelawe pōkole;
4. Nā pono o ka phenolic: non combustible, ʻaʻohe kinoea a me ka uahi ma hope o ka puhi ʻana, haʻahaʻa haʻahaʻa thermal conductivity, maikaʻi thermal insulation hopena, leo insulation, maikaʻi ka wā kūʻē, a me ke ola lawelawe a hiki i 30 makahiki;
5. Loaʻa iā ia ka hale paʻa paʻa paʻa, haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa a me ka hana insulation thermal maikaʻi, e like me ka polyurethane a ʻoi aku ka maikaʻi o ka polystyrene foam;
6. Hiki ke hoʻohana ma - 200 ℃ ~ 200 ℃ no ka manawa pōkole a me 140 ℃ ~ 160 ℃ no ka manawa lōʻihi.ʻOi aku ia ma mua o ka polystyrene foam (80 ℃) a me ka polyurethane foam (110 ℃);
7. Loaʻa i nā molekala Phenolic nā kalapona, hydrogen a me oxygen wale nō.Ke waiho ʻia i ka decomposition wela kiʻekiʻe, ʻaʻole ia e hoʻopuka i nā kinoea ʻawaʻawa ʻē aʻe koe wale ka liʻiliʻi o ke kinoea CO.ʻO 5.0%.Ma hope o ka 25mm mānoanoa phenolic foam papa i lalo i ka lapalapa ahi ma 1500 ℃ no 10min, ʻo ka ʻili wale nō ka carbonized akā ʻaʻole hiki ke ʻā, ʻaʻole ia e puhi i ke ahi a ʻaʻole hoʻi e hoʻokuʻu i ka uahi mānoanoa a me ke kinoea ʻawaʻawa;
8. Pa'a ka hu'a phenolic i ka aneane pau loa o na waikona inorganic, na mea hoomeaola a me na mea hoohehee koe wale no ka hiki ke hoino ia e ka alkali ikaika.ʻO ka ʻike lōʻihi i ka lā o ka lā, ʻaʻohe mea i ʻike ʻia i ka wā kahiko, no laila ke kū nei ka ʻelemakule maikaʻi;
9. He haʻahaʻa ke kumukūʻai o ka phenolic foam, ʻo ia wale nō ʻelua hapakolu o ka polyurethane foam.